发明名称 METHOD FOR FORMING PATTERN IN SEMICONDUCTOR MANUFACTURING PROCESS
摘要 PURPOSE: A method for forming a pattern in a semiconductor manufacturing process is provided to remove fully a scum generated from a photoresist pattern formation process by performing ultra violet ray processing. CONSTITUTION: A processing layer(32) is formed on a semiconductor substrate(30). A photoresist layer is formed on the processing layer(32). A patterned mask pattern is formed on an upper portion of the photoresist layer. The light is irradiated selectively on the photoresist layer. The photoresist layer is developed selectively by using a development solution. A photoresist pattern(34a) is formed on an unexposed portion of the photoresist layer(34a). The processing layer(32) is processed by using a ultra violet ray(38).
申请公布号 KR20010064971(A) 申请公布日期 2001.07.11
申请号 KR19990059460 申请日期 1999.12.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BYUN, JEONG U;KIM, DONG YUN;KO, HO
分类号 G03F7/11;G03F7/40;H01L21/027;H01L21/306;(IPC1-7):H01L21/027 主分类号 G03F7/11
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