发明名称 |
METHOD FOR FORMING PATTERN IN SEMICONDUCTOR MANUFACTURING PROCESS |
摘要 |
PURPOSE: A method for forming a pattern in a semiconductor manufacturing process is provided to remove fully a scum generated from a photoresist pattern formation process by performing ultra violet ray processing. CONSTITUTION: A processing layer(32) is formed on a semiconductor substrate(30). A photoresist layer is formed on the processing layer(32). A patterned mask pattern is formed on an upper portion of the photoresist layer. The light is irradiated selectively on the photoresist layer. The photoresist layer is developed selectively by using a development solution. A photoresist pattern(34a) is formed on an unexposed portion of the photoresist layer(34a). The processing layer(32) is processed by using a ultra violet ray(38).
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申请公布号 |
KR20010064971(A) |
申请公布日期 |
2001.07.11 |
申请号 |
KR19990059460 |
申请日期 |
1999.12.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BYUN, JEONG U;KIM, DONG YUN;KO, HO |
分类号 |
G03F7/11;G03F7/40;H01L21/027;H01L21/306;(IPC1-7):H01L21/027 |
主分类号 |
G03F7/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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