| 摘要 |
PURPOSE: An apparatus for correcting a robot arm is to remove the correctional difference occurring during loading and unloading a semiconductor wafer. CONSTITUTION: The apparatus comprises a base frame(110) and a distance adjusting unit(120). Both sides of the base frame comprise a plurality of couplings(111). The couplings are to mount the first and the second robot chuck of the robot arm. The distance adjusting unit comprises a scale plate(121), a plurality of hinges(122), a gear unit(123), the first guide(124) and the second guide(125). The scale plate is mounted on an upper end of the base frame. The hinges are rotatably attached to a lower surface of the base frame. The guides are to adjust the first and the second robot chuck. A distance indicating portion(126) is attached to the first and the second guide. When adjustment of the first and the second robot chuck is completed, distance between its ends is indicated on the scale plate.
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