| 摘要 |
PURPOSE: A bonding agent and a bonding film for semiconductor package are provided to improve the reliability of a semiconductor device by lowering a characteristic for absorbing moisture. CONSTITUTION: An epoxy mixture is formed. The epoxy mixture is mixed with a normal epoxy according to various mixing ratios. A bonding agent for semiconductor package is formed by adding A poly(acrylonitrile-co-butadiene), a poly(acrylonitrile-co-butadiene-co-styrene), a poly(acrylonitrile-co-butadiene-co-methy methacrylate), a poly(n-butyl acrylate), a rubber such as a modified natural rubber, a modified acrylate rubber, and a polyurethane rubber to the mixture. A bonding film is formed by processing the bonding agent to a film type.
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