Hybrid leadframe having conductive leads less deformable and semiconductor device using the same

摘要

A hybrid leadframe has first conductive leads extending into space over a semiconductor chip and second conductive leads outside the space, the first conductive leads and the second conductive leads are connected through bonding wires to bonding pads on the semiconductor chip, and the first conductive leads are directly adhered to insulating adhesive compound layers spread on predetermined area of the upper surface of the semiconductor device, wherein the second conductive leads are bifurcated so that one of the bifurcated portions is connected through the bonding wire to the bonding pad and the other bifurcated portion is adhered to the insulating adhesive compound layers so as to enhance the stability of the second conductive lead.