| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a substrate for an electronic part which has a metal layer thinner than a conventional copper-plated substrate and can realize the same reliability as the conventional copper-plated substrate. SOLUTION: A method of manufacturing a substrate for an electronic part includes the steps of: preparing a metal-plated substrate including a resin base material 2 and a metal sheet 3 pressed on the surface of the resin base material 2, wherein the contact surface of the metal sheet 3 with the resin base material 2 is a mat surface, and the surface of the resin base material 2 in contact with the mat surface is roughened in response to the irregularities of mat surface; etching away the whole metal sheet 3 from the metal-plated substrate; and forming a metal layer 4 thinner than the metal sheet 3 on the surface of the resin base material, on which the metal sheet 3 has been pressed, by a nonelectrolytic plating method.
|
