发明名称 METHOD OF SURFACE TREATMENT AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device, without characteristic deterioration caused by carrier accumulation, when silicon functions as a donor or caused by deterioration in surface morphology. SOLUTION: A semiconductor device includes a GaAs substrate 1 or a first GaAs epitaxial base film 7 formed on the GaAs substrate 1, and a second or more GaAs epitaxial layers 3 and 4 formed on the substrate 1 or on the base film 7. After the silicon and the silicon compound 5 exist on the surface of the substrate 1 or the base film 7 are surface-treated with aqueous ozone, the second or more GaAs epitaxial layers 3 and 4 are made grown to form the semiconductor device.
申请公布号 JP2001189278(A) 申请公布日期 2001.07.10
申请号 JP19990375608 申请日期 1999.12.28
申请人 DOWA MINING CO LTD 发明人 SAKAMOTO RYO;TOBA RYUICHI;IKEDA HIROYUKI
分类号 H01L21/205;C30B29/40;H01L21/283;H01L21/304;H01L21/338;H01L29/812;(IPC1-7):H01L21/205 主分类号 H01L21/205
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