| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of superior solidifying characteristics, bending, packing characteristics, and appearance through injection-molding with a molding material which is satisfactory in long-term conservation characteristics at normal temperature. SOLUTION: A semiconductor element is sealed with a injection molding device comprising an injection unit of screw in-line method, using an epoxy resin molding material comprising, as essential component, epoxy resin, phenol resin, hardening accelerator, and inorganic filler where an A component with the epoxy resin and inorganic filler being mixed, melted under heat, kneaded, and crushed, and a B component where the phenol resin, solidification accelerator, and remaining inorganic filler are mixed, molten under heat, kneaded, and crushed, are mixed together before molding under heat.
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