| 摘要 |
PROBLEM TO BE SOLVED: To improve an yield (productivity) in the production, to improve the quality and uniformity of an IC card and to substantially improve a merchandise property. SOLUTION: This device is provided with a lamination base material clamping part 1y constituted separately from a production device body 1x and provided with an upper clamping part 5u and a lower clamping part 5d for clamping and tightly sealing the lamination base material M from both surface sides. The upper clamping part 5u and the lower clamping part 5d are constituted of plate parts 6u and 6d same as pressurizing surfaces 3u and 3d or projected outwards by a prescribed width Xe from eh pressurizing surfaces 3u and 3d, frame parts 7u and 7d larger than the plate parts 6u and 6d and connection parts 8u and 8d for connecting the plate parts 6r and 6d and the frame parts 7u and 7d and absorbing the deformation by heat of the plate parts 6u and 6d. |
