| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion between resin and a carrier tape, and to reduce possibility of the resin peeling off. SOLUTION: There are provided a tape supply/discharge process, where a carrier tape 3 on which a resin 5 for sealing an element 4 is supplied through a tape inlet 15 of an over 2 and discharged through a tape outlet 16 the oven 2, and a heating/curing process, where the feeding direction of the carrier tape 3, is reversed by reversing means 6 and 7 which reverse the carrier tape 3 during the tape supply/discharge process while the resin 5 is heated and cured in the oven 2. Nitrogen gas, introduced into the oven 2 to keep the inside of it in an non-oxidizing atmosphere is exhausted from above the oven 2. The resin curing device provides the resin-cure method.
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