| 摘要 |
PROBLEM TO BE SOLVED: To provide a rotary processing device for greatly reducing contamination on a semiconductor wafer due to cleaning and drying. SOLUTION: This single-wafer processing rotary processing device is provided with a rotary table 12 on which a semiconductor wafer 11 is placed and a spin cup 10 which surrounds the rotary table and is provided with an upper cylindrical neck 10a and a lower extending cup-like part 10b, to prevent scattering of a cleaning liquid from a wafer. A slit 17 which communicates with the outside of the device, is formed in an almost cylindrical air flow return part 10c formed projectingly in the cup-like part from the neck 10a of the spin cup 10, so as to control the air flow in the device. The slit 17 may have a width enough to produce a capillary phenomenon and be communicated with a forced draining device provided outside.
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