| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles, an anisotropic conductive adhesive, and a conductively connected structure, which have a high adhesion between a polymer fine particles and metal plating layer, a low connection resistance, a larger electric capacity at connection, and high connection reliability by stable connection. SOLUTION: Conductive fine particles are formed by covering the surface of polymer fine particles with a low resistance metal layer. The low resistance metal layer is covered using a low resistance metal plating bath of 7-8 pH non-inclusive.
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