发明名称 MULTI-LAYER STRUCTURE MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a multi-layer structure molding material of a styrene resin/ethylene polyvinyl alcohol copolymer which retains the superb moldability of styrene resin and also the imparted barrier properties and is thermally moldable even at temperatures 120 deg.C or below. SOLUTION: This multi-layer structure molding material is of a multi-layer structure formed by combining and laminating (A) an ethylene/vinyl alcohol compolymer layer, (B) an adhesive resin layer and (C) a styrene resin layer. In addition, the ethylene/vinyl alcohol copolymer of the (A) layer shows such a DSC behavior that the integral value S1 upto and including 160 deg.C is 30% or above of S, the integral value S2 upto and including 150 deg.C is 20% or above of S, the integral value S3 upto and including 140 deg.C is 15% or above of S, the integral value S4 upto and including 130 deg.C is 10% or above of S and the integral value S5 upto and including 120 deg.C is 5% or above of S, when the total integral value of DSC peaks in heating process is given as S.
申请公布号 JP2001187435(A) 申请公布日期 2001.07.10
申请号 JP20000393849 申请日期 2000.12.25
申请人 IDEMITSU PETROCHEM CO LTD 发明人 AKAMATSU MASAHIRO;HIGASHIYA OSAMU;YUKIMOTO TORU
分类号 B32B27/28;B32B27/30;C08L25/06;C08L25/10;(IPC1-7):B32B27/28 主分类号 B32B27/28
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