摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer structure molding material of a styrene resin/ethylene polyvinyl alcohol copolymer which retains the superb moldability of styrene resin and also the imparted barrier properties and is thermally moldable even at temperatures 120 deg.C or below. SOLUTION: This multi-layer structure molding material is of a multi-layer structure formed by combining and laminating (A) an ethylene/vinyl alcohol compolymer layer, (B) an adhesive resin layer and (C) a styrene resin layer. In addition, the ethylene/vinyl alcohol copolymer of the (A) layer shows such a DSC behavior that the integral value S1 upto and including 160 deg.C is 30% or above of S, the integral value S2 upto and including 150 deg.C is 20% or above of S, the integral value S3 upto and including 140 deg.C is 15% or above of S, the integral value S4 upto and including 130 deg.C is 10% or above of S and the integral value S5 upto and including 120 deg.C is 5% or above of S, when the total integral value of DSC peaks in heating process is given as S.
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