| 摘要 |
A positioning apparatus positions a movable body 6 on which a wafer W (object to be positioned) is mounted, and includes; a magnetism generation body 8 incorporated in the movable body 6, a magnetic member 10, 15A, 15B, 16 formed so as to have the magnetism generation body 8 therebetween, and a drive unit 11 disposed between the magnetism generation body 8 and the magnetic member 10, for driving the magnetism generation body 8, and the movable body 6 is positioned by means of the magnetic member 10 etc. and the drive unit 11. The positioning apparatus can position a movable body (object to be positioned) at a high speed and with high precision, and is suitable for use for example with an exposure apparatus or the like for positioning a wafer at high precision.
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