PHOTOSENSITIVE POLYMER AND CHEMICAL AMPLIFICATION TYPE RESIST COMPOSITION CONTAINING SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive polymer which satisfactorily ensures dry etching resistance while keeping the production cont low and has superior adhesiveness to an under film and a resist composition for ArF excimer laser containing the polymer. SOLUTION: The photosensitive polymer has a weight average molecular weight of 3,000-100,000 and is represented by formula 1 (where R1 is H or methyl; R2 is acid-decomposable tertiary alkyl; and m/(m+n)=0.5 to 0.8).