发明名称 |
Offset alignment marks method and apparatus |
摘要 |
Offset alignment marks and a method of forming offset alignment marks within a kerf region of a semiconductor wafer in the manufacture of semiconductor devices includes the steps of forming a first track of a kerf and forming a second track of the kerf. The first track includes at least one alignment mark region having a first alignment mark disposed therein for use in an alignment of a first field of a first semiconductor chip active area. The second track includes at least one alignment mark region having a second alignment mark disposed therein for use in an alignment of a second field of a second semiconductor chip active area. The alignment mark regions of the first track and the second track are complementary and interlocking alignment mark regions extending across a centerline of the kerf and arranged in an offset manner with respect to one another along the kerf.
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申请公布号 |
US6259164(B1) |
申请公布日期 |
2001.07.10 |
申请号 |
US19990283992 |
申请日期 |
1999.04.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BATTERSON ROBERT R.;NORRIS KATHERINE CECELIA;SONNTAG PAUL DAVID |
分类号 |
G03F9/00;H01L23/544;(IPC1-7):H01L23/544 |
主分类号 |
G03F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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