发明名称 Determination of flux prior to package assembly
摘要 A package assembly is formed by applying flux to a device and/or a substrate and inspecting the applied flux to determine whether the amount applied is within a predetermined range. Embodiments include applying a rosin based flux on a laminate substrate and measuring the thickness of the applied flux with an interferometer.
申请公布号 US6258612(B1) 申请公布日期 2001.07.10
申请号 US20000642832 申请日期 2000.08.22
申请人 ADVANCED MICRO DEVICES, INC. 发明人 MASTER RAJ N.;HALDERMAN JONATHAN D.
分类号 H01L21/60;H01L21/66;(IPC1-7):H01L21/66;H01L21/00;G01R31/26 主分类号 H01L21/60
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