发明名称 Integrated circuit container having partially rugged surface
摘要 Disclosed is a bi-level container capacitor in which a bottom portion is smooth and an upper portion is rugged or rough. Once the container has been formed within a thick insulating layer, a conductive layer is conformally deposited over the container interior surfaces. The bottom portion of the container, which is narrowly confined between two gate electrodes, is isolated from further processing by filling the bottom portion with a protective film. A rugged conductive layer is then formed only on the surface of the upper portion of the container, after which the protective film is removed from the bottom portion. As a result, a capacitor bottom plate conforms to the interior surfaces of the container, the bottom plate including a rugged upper portion and a smooth bottom portion.
申请公布号 US6259127(B1) 申请公布日期 2001.07.10
申请号 US19980070327 申请日期 1998.04.30
申请人 MICRON TECHNOLOGY, INC. 发明人 PAN PAI-HUNG
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L21/02
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