发明名称 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup device, which is capable of reducing smears and superior in various properties such as transfer properties, read-out proper ties and the like, and to provide a method of manufacturing the same. SOLUTION: A solid-state image pickup device 1 is equipped with a sensor 2, vertical transfer register 10 with a transfer electrode 11, shunt wiring 14 of high-melting metal, and light shielding film 3, where the shunt wiring 14 is insulated from the light shielding film 3 with an oxide film 8, insulating film 6 which serves as a stopper film when the oxide film 8 is patterned is formed, and the oxide film 8 and the insulating film 6 are not formed under the overhang of the light shielding film 3. This method of manufacturing the image pickup device 1 comprises a step, in which the vertical transfer register 10 provided with the sensors 2 and the transfer electrodes is formed, a step in which an etching stopper film formed of the insulating film 6 is formed, a step in which the shunt wiring layer 14 of high-melting metal is formed, a step in which the oxide film 8 is formed on all the surface, a step in which the oxide film 8 on the sensors 2 and a part of the etching stopper film 6 at least at the transfer electrode 11 side on the sensors 2 are successively removed, and a step in which the light shielding film 3 is formed.
申请公布号 JP2001189443(A) 申请公布日期 2001.07.10
申请号 JP19990375013 申请日期 1999.12.28
申请人 SONY CORP 发明人 MARUYAMA YASUSHI
分类号 H01L27/146;H01L27/148;H01L31/0216;H04N5/335;H04N5/341;H04N5/359;H04N5/361;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/146
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