Bond pad for stress releif between a substrate and an external substrate

摘要

A metal pattern 4 is formed at a rear surface of a substrate 3 at a front surface of which a molded semiconductor chip is mounted, the metal pattern 4 is covered with an insulating film 5 except at its connecting area 4a and a solder ball 6 is bonded to the connecting area 4a. The area of the metal pattern 4 other than the connecting area 4a inclines toward the substrate 3 and gradually becomes thinner toward the outside. Stress, which is applied to the solder ball 6, is imparted in a diagonal direction and is dispersed. As a result, the number of occurrences of cracks X is reduced and the solder ball which is used to achieve connection with an external substrate is effectively prevented from becoming electrically disconnected.