发明名称 |
Method of interconnecting electronic components using a plurality of conductive studs |
摘要 |
A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.
|
申请公布号 |
US6258625(B1) |
申请公布日期 |
2001.07.10 |
申请号 |
US19990315374 |
申请日期 |
1999.05.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BROFMAN PETER J.;RAY SUDIPTA K.;STALTER KATHLEEN A. |
分类号 |
H01L21/60;H01L23/498;H05K3/32;(IPC1-7):H01L21/44;H01L23/52 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|