| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ceramic wiring board, in which the thermal conductivity of an insulating board is improved and which has excellent heat-dissipation characteristics, in the ceramic wiring board using alumina ceramics as the insulating board. SOLUTION: In the ceramic wiring board in which a metallized wiring layer composed of a conductor using tungsten or molybdenum as a main component is covered and formed to the surface and/or inside of the insulating board 1 comprising ceramics using alumina containing MnO2 having relative density of 95% or more at the ratio of 2.0-10.0 wt.% as the main component, a high thermal conductor 5, which consists of a conductor containing copper at the ratio of 10-70 wt.% and tungsten and/or molybdenum at the ratio of 30-90 wt.% and in which plane conductors 3 and vertical conductors 4 are buried in a lattice shape and the total of the sectional areas of the vertical conductors 4 is set in 40-80% of the whole area of the areas of the forming regions of the high thermal conductor 5 in a plane, is buried into the insulating board 1. |
