| 摘要 |
PROBLEM TO BE SOLVED: To enable three dimensional mounting by realizing further low ESL of a layered capacitor. SOLUTION: First inner electrodes 14 are arranged in a dielectric element assembly 12, and second inner electrodes 16 are arranged below the first inner electrodes 14, interposing a ceramic layer 12A. In the dielectric element assembly 12, first through-hole electrodes 18, which penetrate the second inner electrodes 16 and are electrically connected with the first inner electrodes 14, and second through-hole electrodes 20, which penetrate the first inner electrodes 154 and are electrically connected with the second inner electrodes 16 are arranged into a pillar form, in such a manner that they are stretched intersecting the inner electrodes 14, 16. The first through-hole electrodes 18 are electrically connected with first external electrodes 22, which are arranged like islands on an upper and a lower plane parts 12B, and the second through-hole electrodes 20 are electrically connected with second external electrodes 24, which are arranged like islands on surfaces of the dielectric element assembly 12. |
