发明名称 Vertical-heat-treatment apparatus with movable lid and compensation heater movable therewith
摘要 A vertical-heat-treatment apparatus for semiconductor wafers has a compensation heater disposed under a lid for opening and closing a port at the bottom of a process chamber. The compensation heater heats the semiconductor wafers on a wafer boat from below through a window arranged on the lid. The compensation heater has seven heating lamps attached to a fixed base, which is vertically moved along with the lid, and rotatable reflection mirrors respectively surrounding the lamps.
申请公布号 US6259061(B1) 申请公布日期 2001.07.10
申请号 US19980150303 申请日期 1998.09.09
申请人 TOKYO ELECTRON LIMITED 发明人 OSAWA TETSU
分类号 H01L21/22;H01L21/00;H01L21/205;H01L21/324;(IPC1-7):H01L21/22 主分类号 H01L21/22
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