| 摘要 |
<p>PROBLEM TO BE SOLVED: To always adhere a wafer at the same position of a mount board. SOLUTION: A mount board 5 is placed in a chamber 1, and a suction pad 9 for sucking/holding a wafer 4 through a vacuum holding is provided on the upper side thereof. The suction pad 9 is shrunk, while holding the wafer 4. Then, the chamber 1 is evacuated. When the level of vacuum in the chamber 1 exceeds that of the suction pad 9, the suction pad 9 is elongated, the water 4 is released, and then it is placed on the mount board 5 for sticking.</p> |
