| 摘要 |
PROBLEM TO BE SOLVED: To install features in the lamination and manufacturing methods of a wiring board, to make a manufacturing process to be simple and mass- productivity to be satisfactory, to reduce cost and to improve the reliability of connection. SOLUTION: A first flexible wiring board 10 and a second flexible wiring board 20 are stuck and jointed. A first conductive pattern 15 and a second conductive pattern 23, which are arranged on non-stickling faces, are mutually conducted. A through hole 16b and through holes 24 confronted with it are formed in the wiring boards. The through hole 16b is filled with a first conductive material 17b conducted with the first conductive pattern 15. The through hole 24 is filled with a second conductive material 25 conducted with the first conductive material 17 and the second conductive pattern 23 from a non-sticking face-side. |
