| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can effectively prevent the cracking of a connection conductor filled in a through hole and can suppress the conductor resistance of the connection conductor to be low. SOLUTION: In the multilayer wiring board, a first wiring layer 2 and a second wiring layer 3 are sequentially laminated on the board 1 through an insulating layer 4, and the first wiring layer 2 and the second wiring layer 3 are electrically connected by the connection conductor 6 in the through hole 5 installed in the insulating layer 4. Then, only 0.3 wt.% to 7.5 wt.% of molybdenum oxide fine grains are included in the connection conductor 6. |
