| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device for a substrate capable of bonding a warped substrate to another substrate in a stable state. SOLUTION: The bonding device for a substrate has a stage for holding a first substrate, a pressing tool disposed above the stage, an elastic member for holding the center portion of a second substrate such that it is supposed nearly parallel to the first substrate mounted on the pressing tool, and a driving unit for driving the pressing tool so as to move the second substrate in the direction of the first substrate, wherein the driving unit moves the pressing tool in the direction of the stage to press the second substrate along the warpage of the first substrate.
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