MANUFACTURING METHOD FOR RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem where there has been a limit in the reduction of thickness when a semiconductor device is configured with a lead frame. SOLUTION: A semiconductor element is mounted on a frame member comprising a plurality of land components and an element mounting region, where a semiconductor element is mounted prior to electrical connection and resin- sealing, and then a resin-sealed semiconductor device component 25 is isolated from the frame member. The entire thickness of the resin-sealed semiconductor device component 25 is scraped with a cutting member 27 from the bottom surface side into a desired thickness, so that the bottom surface of a semiconductor element 22 is exposed in the bottom surface region of a sealing resin 24, while the bottom surface of an external electrode 26 is exposed. Thus, an ultra thin resin sealing type semiconductor device is provided.