| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress degradation in characteristics as much as possible for satisfactory workability by shortening the metal wire for wiring, without damaging the electrical characteristics or thermal conductivity when a high-frequency semiconductor device and a connection board are mounted on a pedestal. SOLUTION: A pedestal 3, a connection board 1 which is tightly fitted to it and provided with a through-hole 9, and a high-frequency semiconductor device 2 are provided. The through-hole 9 is filled with a metal 7 of satisfactory conductivity and thermal conductivity, while being oval in shape, which is long in the direction perpendicular to an input/output signal line. A wiring pattern 4 is provided on the connection board 1 and the high-frequency semiconductor device 2 is die-bonded on the metal later 7 packed into the through-hole 9, with the high-frequency semiconductor device 2 electrically connected to the connection board 1 using a wire 5.</p> |
