| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor module, where a high-frequency element and other intermediate/low frequency elements are made to operate correctly, even with a smaller package. SOLUTION: There are provided ceramic substrates 1-3, where a recess 17 is formed on the backside, a high-frequency element 4 mounted in the recess 17, a lid 5 which closes the opening of recess 17 to provide a cavity, an IC chip 6 mounted on the front aside of the ceramic substrate 1, a resin 7 which overcoats the IC chip 6, constellations 12 and 13 for external connection formed on the side surfaces of ceramic substrates 2 and 3, and an internal wiring for signal delivery between the high-frequency element 4 and the IC chip 6 and for electrical connection between the castellations 12 and 13 and the IC chip 6 and/or high-frequency element 4.
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