| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board where a mounting place for electronic component is compact especially in thickness direction and the electric connec tion to the electronic component is ensured as well as an improved reliability. SOLUTION: A substrate 10 is provided with a recess 11, in which an IC chip 16 is housed. A bottomed hole 12, where the rear surface is closed with a wiring pattern layer 15 of substrate 10, is formed on the bottom surface of the recess 11. The IC chip 16 is bonded to the rear surface of the wiring pattern layer 15, which closes the bottomed hole 12. Thus, a wiring board 1 whose thickness is equal to that of substrate 10, even at the mounting place for the IC chip 16, is provided.</p> |
