MANUFACTURING METHOD OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of preventing a metallic chemical plating layer from widening. SOLUTION: A photo-resolving catalyst for precipitating a catalyst only at a portion irradiated with light is applied to the surface of an insulating substrate, a plating resist which is decomposed and removed by exposure and development is applied on the photo-resolving catalyst, and a mask forming a predetermined pattern is placed on the plating resist and is subjected to exposure and development in this state to produce a predetermined metal wiring pattern.