Method of forming a patterned organic dielectric layer on a substrate

摘要

An organic dielectric material is patterned on a substrate in a process utilizing a patterned resist which contains a metalloid or metallic element at the time of pattern transfer to the organic dielectric layer. The organic dielectric layer is preferably patterned using an oxygen etching process, most preferably oxygen reactive ion etching. The process advantageously avoids the need for a hard mask.