| 摘要 |
PROBLEM TO BE SOLVED: To substantially improve yields in semiconductor manufacturing and processing. SOLUTION: A semiconductor element manufacturing system, a semiconductor element manufacturing method and a computer readable recording medium storing a semiconductor element manufacturing program comprises aΔZn,ΔZp calculating unit 111 for calculating the width of a substrate,ΔZn,ΔZp, corresponding to the difference between the reverse layer capacitance led from a classical theory with regard to electrons, holes and the reverse layer capacitance led from the quantum theory; a substrate properties displacing unit 112 for displacing the values of the properties in a semiconductor substrate with reference toΔZn,ΔZp; and an electric characteristics analyzing unit 116 for predicting electric characteristics of semiconductor elements taking the displaced properties into consideration, and determining the manufacturing conditions for manufacturing the semiconductor elements having desired electric characteristics based on the predicted electric characteristics of the semiconductor elements.
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