| 发明名称 |
Modular high frequency integrated circuit structure |
| 摘要 |
Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
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| 申请公布号 |
US6259148(B1) |
申请公布日期 |
2001.07.10 |
| 申请号 |
US19990330614 |
申请日期 |
1999.06.11 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARTUSH THOMAS ADAM;HARAME DAVID LOUIS;MALINOWSKI JOHN CHESTER;PICIACCHIO DAWN TUDRYN;TESSLER CHRISTOPHER LEE;VOLANT RICHARD PAUL |
| 分类号 |
H01L21/302;H01L21/768;H01L21/822;H01L23/522;H01L23/532;H01L23/66;H01L27/04;(IPC1-7):H01L23/48;H01L39/02 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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