| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can speed up the transportation of a substrate. SOLUTION: A substrate 6 mounted with electronic components which is held by a positioning section is separated from the positioning section 5 by being levitated above the positioning section 5 by means of a substrate transportation mechanism 9. Immediately therafter, a substrate 20 not mounted with electronic components is carried into the positioning section by a substrate carry-in means 19 and then the substrate mounted with electronic components held by the substrate transportation mechanism 9 is transported to a carry-out means 21. |
