发明名称 |
Wafer surface machining apparatus |
摘要 |
A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.
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申请公布号 |
US6257966(B1) |
申请公布日期 |
2001.07.10 |
申请号 |
US19990298998 |
申请日期 |
1999.04.26 |
申请人 |
TOKYO SEIMITSU CO., LTD. |
发明人 |
ISHIKAWA TOSHIHIKO;KATAGIRI YASUSHI |
分类号 |
B24B37/04;B24B37/34;B24B41/00;H01L21/683;(IPC1-7):B24B7/22 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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