发明名称 METHOD OF TRANSPORTING SUBSTRATE IN ELECTRONIC COMPONENT MOUNTER
摘要 PROBLEM TO BE SOLVED: To provide a method of transporting a substrate in an electronic component mounter which can increase the electronic component mounting efficiency by making a transition between substrate carry-in and carry-out steps efficiently. SOLUTION: Two substrate positioning sections 11A, 11B are installed, A substrate carry-in section 12 and a substrate carry-out section 13 can be selectively moved by means of cylinders 23, 24 to either of the positions where they are connected to the positioning section 11A and where they are connected to the positioning section 11B. Two substrates 4 positioned in the two positioning sections 11A, 11B respectively are mounted with electronic components in parallel with each other. When one of the substrates 4 is finished up in mounting, the carry-in section 12 and the carry-out section 13 are moved to either positions where they are connected to the positioning section 11A and where they are connected to the positioning section 11B to carry in or out the substrates 4.
申请公布号 JP2001189595(A) 申请公布日期 2001.07.10
申请号 JP20000373912 申请日期 2000.12.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ONIZUKA YASUTO
分类号 H05K13/02 主分类号 H05K13/02
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