| 摘要 |
PURPOSE: An apparatus for bonding a chip scale package die is provided to increase production efficiency regardless of time interval of a bonding process by having two bonding heads, and to obviate the necessity of additional time for a bad die by using two die absorbing units to differentiate a good die from the bad die. CONSTITUTION: A boat transfer unit(110) transfers a boat(1) to which a chip scale package(CSP) film is adhered. The boat is mounted in the first and second indexes(120,220) wherein a die bonding process is performed. A die supply unit(140) positions a wafer in a supply position, and determines whether the die is good. A robot arm(150) selectively transfers the die depending on whether the die is good. The first and second mounting stages(160,260) perform a position inspection and a position correction of the die transferred by the robot arm, and support the die in a bonding process. The first and second head parts(170,270) supplies the boat from the boat transfer unit to the first and second indexes, bonding the die on the first and second mounting stages to the CSP film and unloading the bonding-completed boat to the boat transfer unit.
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