LEAD FRAME FOR SWITCH DEVICE

摘要

PURPOSE: A lead frame for a switch device is provided to prevent the position of a heat sink part from being turned aside by a physical impact generated during an assembly process of the switch device. CONSTITUTION: The lead frame has a connection bar(38). The lead frame has a strip type to assemble a plurality of switch devices. That is, a semiconductor device for switch is attached on an upper surface(35) of the heat sink part which emits heat generated in the semiconductor device to the external. A lead part(36) is connected to the semiconductor device electrically through a wiring bond and is formed under the heat sink part. The heat sink part is connected with the lead part by a tie bar(34) formed between the heat sink part and the lead part. And, a connection part(33) is formed on an upper part of the heat sink part.