发明名称 Semiconductor device and method for manufacturing a passivation layer on a semiconductor device
摘要 A high voltage semiconductor device comprises two terminals (9, 10) on opposite sides of and interconnected by a solid layer comprising at least a first diamond layer (6, 7, 8), said device being able to block a voltage for at least one direction of a voltage applied across its terminals (9, 10, 15, 16). At least a surface portion (11) of the diamond layer between the terminals is terminated, the termination being such that the Fermi level at said surface portion is at least 0.3 eV above the valence band and at least 0.3 eV below the conduction band, said surface portion (11) surrounding the device between the terminals.
申请公布号 AU2565201(A) 申请公布日期 2001.07.09
申请号 AU20010025652 申请日期 2000.12.20
申请人 ABB AB 发明人 HANS BERNHOFF;MARK IRWIN;JAN ISBERG;JOHAN HAMMERSBERG;OLOF HJORTSTAM;ERIK JOHANSSON
分类号 H01L21/04;H01L29/16;H01L29/861 主分类号 H01L21/04
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