APPARATUS FOR ANNEALING WAFER AND METHOD FOR ANNEALING WAFER USING THE SAME

摘要

PURPOSE: A method for annealing a wafer is provided to prevent damage to the surface of the wafer and to reduce manufacturing cost, by performing an annealing process using an atomic beam during a short interval of time regarding a desired area. CONSTITUTION: A process for manufacturing a semiconductor device is performed regarding a wafer(4). The wafer is mounted in a wafer holder(5) of an apparatus for annealing the wafer. An atomic beam generated from an atomic beam generating unit(1) of the apparatus for annealing the wafer is irradiated to the inside of the wafer and annealed.