TEMPERATURE COMPENSATION CRYSTAL OSCILLATOR ELEMENT MODULE

摘要

PURPOSE: A temperature compensation crystal oscillator element module is provided to remove interference between the mold layer where IC chip is built-in and the crystal oscillator element. CONSTITUTION: The ceramic layer(100) which at least two or more layers is laminated includes a receipt space(110) which is formed with step shape on the central surface and has predetermined depth. The crystal oscillator(200) is located on the ceramic layer(100). The IC chip(300) is mounted on the receipt space(110) of the ceramic layer(100) and is protected from external impact by the mold layer(500). The protection layer(400) is formed on the edge surface of the ceramic layer(100) with predetermined height to prevent the contact between the crystal oscillator(200) and the mold layer(500).