| 摘要 |
PURPOSE: A hermetic package is provided, which has a lid guide guiding a lid so that the lid is sealed to a sealing region accurately. CONSTITUTION: The hermetic package has a lid guide(33). A semiconductor chip(32) is attached to a bottom of a chip mounting space(44) formed on a center of a package body(40). A metal line pattern(46) and the semiconductor chip are connected by a bonding wire(38) electrically. And, the chip mounting space where the semiconductor chip is mounted is sealed by attaching a lid to a sealing region formed around the chip mounting space. The package body is fabricated with a ceramic material and has the chip mounting space. the lid guide is formed to be adjacent to the outer of the sealing region, in order to prevent the lid from being attached out of the sealing region. The top of the lid cover is not higher than the top of the lid. |
