| 摘要 |
PURPOSE: A method for electroplating tin is provided which simultaneously appropriately controls the melting rate of tin particles into a tin electroplating solution, and restrains the generation of sludge in the plating solution due to the oxidation of tin ions which exist in the state of Sn¬2+ by differently controlling the dissolved oxygen concentration of a fluidized bed reactor and a plating solution circulating vessel respectively. CONSTITUTION: In a method for continuous electroplating tin on the surface of a metal strip charged with a cathode using an insoluble anode and a sulfuric acid based plating solution having an alkane or benzene group, the method comprises the steps of charging the metal strip (15) with a cathode by dipping a metal strip into a tin plating solution, and electrodepositing tin ions on the surface of the metal strip from the plating solution using an insoluble anode having layers such as platinum or iridium oxides; supplying tin ions to the plating solution by the oxidation reaction with tin particles charged from the upper part of a reaction vessel by supplying a part of the plating solution circulated to an electroplating vessel (14) along with oxygen to the lower part of a fluidized bed reactor (2); and lowering a dissolved oxygen in the plating solution by flowing the plating solution supplied to the electroplating vessel from the fluidized bed reactor through one or more intermediate circulation vessels in which oxygen partial pressure is maintained low.
|
