| 摘要 |
PURPOSE: A grinding plate for manufacture of semiconductor device is provided to restrain defect in a grinding process and reduce consumption of abrasive by uniformly distributing abrasive on a grinding surface. CONSTITUTION: A grinding plate(100) has a grinding surface(102) with radius grooves(101a). The radius grooves(101a) are rounded in a direction the same as the rotation direction of the grinding plate(100). A number of eccentric circle-shaped grooves(101b) are provided from the center of the grinding surface(102) to the outer periphery to intersect with the grooves(101a). The grinding plate(100) with the grooves(101a) and the grooves(101b) allows abrasive to be efficiently distributed on the whole grinding surface(102), and prevents abrasive from rapidly flowing toward the periphery of the grinding surface(102).
|
