发明名称 COOLING APPARATUS FOR PRINT BOARD ASSEMBLY
摘要 PURPOSE: A cooling apparatus for a print board assembly is provided to enhance the cooling efficiency without using a blow fan in an outdoor system difficult to employ a forced cooling method using the blow fan, thereby saving energy consumption due to the blow fan as well as removing fan noise. CONSTITUTION: The print board assembly(14) having circuit chips(16) is installed on a copper plate(10). A heat pipe(12) connected to the circuit chip(16) is mounted on one side of the copper plate(10), and a heat sink(20) having radiator pins(22) is mounted on the other side of the copper plate(10). At this time, a flat side of the heat sink(20) is positioned within a rack body(18) and the radiator pins(22) is positioned outside the rack body(18). Therefore, heat generated from the circuit chip(16) is transferred to the copper plate(10) through the heat pipe(12).
申请公布号 KR20010063385(A) 申请公布日期 2001.07.09
申请号 KR19990060456 申请日期 1999.12.22
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JU, JAE HUN
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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