| 摘要 |
PURPOSE: A printed circuit board is provided to prevent a short of a lead and maintain bonding force of the lead. CONSTITUTION: A plurality of lands(10) are soldered by being connected with a lead of a mounted component. A printed circuit board has the lands(10). A soldering avoided region(15) is formed within a region adjacent to the lead of the lands. The soldering avoided region is formed with a line which divides the land(10) into at least two portions. Divided areas of the land which is divided by the soldering avoided region are similar to each other. The soldering avoided region is formed by a silk printing. The soldering avoided region(15) is variously installable according to a shape or an area of the land(10). In case of a component which has a plurality of leads and electrodes, the land has a narrow width and longitudinally formed on a side. Further, a pitch between the lands is small.
|
