PURPOSE: A semiconductor package is provided to transfer efficiently heat generated from an inside of a package to a heat-sink by forming a dam to prevent outflow of an adhesive. CONSTITUTION: A semiconductor chip(110) is bonded on a substrate(120). An adhesive(150) is applied on a rear face of the semiconductor chip(110). A cover(140) has a chip mounting space(142). A bottom face of the chip mounting space(142) is adhered to the adhesive(150). A surrounding portion of the chip mounting space(142) is supported by an upper portion of the substrate(120). An external connection terminal(130) is formed on a lower face of the substrate(120). The external connection terminal(130) is connected with the semiconductor chip(110). A heat-sink(160) is adhered to an upper face of the cover(140). A dam(148) is formed on a bottom face of the chip mounting space(142).
