| 摘要 |
An electronic component includes a semiconductor device (320) over a circuit board (210, 910), a heat sink (240, 940) over the semiconductor device, a clip (250, 950) over the heat sink and coupling the heat sink to anchors (230, 930) adjacent to the semiconductor device. A method of assembling the electronic component includes using an automated tool to couple the anchors to the circuit board, reflowing solder to electrically couple the semiconductor device and the anchors to a ground plane in the circuit board, and removably coupling the heat sink to the anchors. |
